@article{oai:nifs-repository.repo.nii.ac.jp:00011077,
 author = {NOGAMI, Shuhei and NOTO, Hiroyuki and TOYOTA, Michitoshi and HATTORI, Takaya and OTOMO, Kohei and HASEGAWA, Akira},
 issue = {A},
 journal = {Fusion Engineering and Desig},
 month = {Nov},
 note = {To develop joints using W materials with different thermo-mechanical properties, solid state diffusion bonding involving two different W materials (pure W, K-doped W, or K-doped W-3%Re) and using a pure V interlayer (1.5 mm, 0.5 mm, or 0.05 mm thick) were carried out at 1250 °C for 1 h. The use of a thin interlayer was found to be effective from the point of optimizing the strength and thermal diffusivity. Diffusion bonding at lower temperatures or utilizing W materials with higher recrystallization temperatures were also determined to be effective because pure W can recrystallize at 1250 °C. Further evaluation of a wide range of interlayer thicknesses and thermo-mechanical test conditions is necessary based on the present work to obtain optimum W/V/W joints.},
 pages = {76--81},
 title = {Solid state diffusion bonding of doped tungsten alloys with different thermo-mechanical properties},
 volume = {136},
 year = {2018}
}